专注散热模组和风扇
型号 (Model)
J9
处理器架构 (CPU Socket)
AMD SP3 ILM
机箱架构 (Solution)
3U Server and Up ( Active )
尺寸 (Dimensions)
120.0 x 95.0 x 126.3 mm
功耗 (TDP)
250W
材质 (Material)
AL Base + Cu Block +AL Fin + 6HP + 9225 Fan
导热膏 (Thermal Grease)
Dow Corning TC-5218 Pre-Applied
热线
13669555177 7*24小时服务热线
