专注散热模组和风扇
处理器架构 | Intel FCLGA 3647 Narrow ILM | ||||||||
---|---|---|---|---|---|---|---|---|---|
机箱架构 | 2U Server and Up ( Active ) | ||||||||
尺寸 | 108.0 x 78.0 x 64.0 mm | ||||||||
功耗 | 205W |
型号 (Model) | J3 |
处理器架构 (CPU Socket) | Intel FCLGA 3647 Narrow ILM |
机箱架构 (Solution) | 2U Server and Up ( Active ) |
尺寸 (Dimensions) | 108.0 x 78.0 x 64.0 mm |
功耗 (TDP) | 205W |
材质 (Material) | AL Base + Cu Block +AL Fin + 4HP + 6025 Fan |
导热膏 (Thermal Grease) | Shin-Etsu X23-7783D Pre-Applied |
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